Chip-on-Board

Opto Technology designs and manufactures custom chip-on-board assemblies with single and multi-wavelengths from UV to IR with custom filters, photo detectors, optics and heat sinks.

Key Capabilities

• Extensive relationships with die suppliers that can provide special bins for wavelength and output
• Tighter bin control for color temperature than industry standards via proprietary phosphor mix/deposition process
• CIE x, y chromaticity control for custom white
• Integration of multiple wavelengths of die with optics, photo detectors and custom filters to achieve maximum output in a small package

Equipment

• Instruments Systems CAS 140CT Spectrometer
• All optical test instruments calibrated and NIST traceable
• Integrating spheres, (UDT, Instrument Systems)
• Optometers with radiometric and photometric sensor heads (Graseby)
• All test equipment driven by LabView test programs

Production Capabilities

• Automated and manual wire bonders (Palomar)
• Automated die bonders (ASM AD896)

Wavelengths

365nm peak 375 nm peak 405 nm peak 415 nm peak 430 nm peak 460 nm dominant 470 nm dominant 490 nm dominant 571 nm dominant

590 nm dominant 625 nm dominant 620 nm dominant 660 nm dominant 690 nm dominant 770 nm peak 850 nm peak 870 nm peak 940 nm peak

Packaging

• Standard headers
• Flexstrips
• Custom ceramic substrates (Alumina, AIN, BeO)
• PCB: FR4, Metal Core