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Looking for alternatives to traditional through-hole technology to speed your high-volume production?

Stay tuned for info about Excelitas’ newest surface-mount packaging designs debuting this week at SENSOR + TEST 2012 in Nuremberg, Germany. Visit Excelitas at SENSOR + TEST in Hall 12, Booth 503.

News & Events

May 3, 2012

Excelitas to Present Three Technical Papers at NDIA’s 56th Annual Fuze Conference in Baltimore
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April 30, 2012

Excelitas to Present Paper on 3D Technology for Semiconductor Optoelectronics at SOPO2012 in Shanghai
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April 17, 2012

Excelitas Technologies Announces Completion of Investment in State-of-the-Art Automation to Expand Capacity for HARLID Production in Response to Accelerating Demand
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April 12, 2012

Excelitas Introduces its Newest High CRI, High R9 “White” ACULED® for Medical OEM Applications
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